Advanced Packaging Lead in Delft

Advanced Packaging Lead in Delft

Delft Full Time Op locatie
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Advanced Packaging Lead at QuantWare, Delft. A lead-level full time position in the Research & Development team, listed under hardware engineering. At QuantWare, you’ll be part of a high-performing team of world-class experts in an ambitious, fast-moving environment. From day one, you’ll have the trust, tools, and support to do your best work. Here’s what you can expect: Competitive salary - A salary that reflects the impact and importance of the role (and of course 8% holiday allowance) Pension that’s built to last - A generous and future-proof pension plan that includes partner and dependent coverage. Flexibility built on trust - We focus on outcomes. Work flexibly, in a hybrid setup, with an open vacation policy that lets you manage your time Personal growth - We invest in your L&D, with a budget available to each team member, dependent on their individual ambitions, development needs, and performance A connected team - We make space to celebrate wins together, with team events, offsites, and spontaneous moments that bring us closer Responsibilities

Plan and lead the development of back-end fabrication and assembly technologies, with a focus on enhancing the flip chip bonding techniques, contacts reliability, and manufacturability of quantum processors to our architecture chip stack. Develop and coordinate integration test plans in collaboration with cross-functional teams. Lead the definition and formalisation of assembly-centric fabrication and process development across the organisation. Establish scalable, well-documented integration procedures to support system growth. Investigate and resolve integration issues and technical anomalies, ensuring alignment with specifications and overall performance targets. Requirements

4+ years of experience in chip assembly development of deep-tech or low-volume technology, preferably flip chip in quantum computing. Hands-on experience with back end process-flow development, and specifically UBM, hard-stops, bumps, detachable contacts / MEMS, flip-chip technologies. A background in superconducting qubits is a significant plus. A background in physics, microwave/RF/electrical engineering, or a related field (PhD is a plus)

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Advanced Packaging Lead in Delft werkgever: Entangled Future

QuantWare is een uitstekende werkgever die zich richt op het ontwikkelen van baanbrekende quantumprocessoren in Delft. Met een sterke focus op samenwerking en innovatie biedt QuantWare een stimulerende werkomgeving waar medewerkers de kans krijgen om te groeien en bij te dragen aan wereldveranderende technologieën. De unieke VIO™ technologie en de mogelijkheid om te werken aan cutting-edge projecten maken het een aantrekkelijke plek voor ambitieuze ingenieurs die willen bijdragen aan de toekomst van quantumcomputing.

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Recruitmentteam van Entangled Future