3D Packaging Engineer at QuantWare, Delft. A mid-level full time position in the Research & Development team, listed under hardware engineering.
At QuantWare, you’ll be part of a high-performing team of world-class experts in an ambitious, fast-moving environment. From day one, you’ll have the trust, tools, and support to do your best work. Here’s what you can expect: Competitive salary - A salary that reflects the impact and importance of the role (and of course 8% holiday allowance) Pension that’s built to last - A generous and future-proof pension plan that includes partner and dependent coverage.
Flexibility built on trust - We focus on outcomes. Work flexibly, in a hybrid setup, with an open vacation policy that lets you manage your time Personal growth - We invest in your L&D, with a budget available to each team member, dependent on their individual ambitions, development needs, and performance A connected team - We make space to celebrate wins together, with team events, offsites, and spontaneous moments that bring us closer
Responsibilities
Tooling Adaptation: Assist in modifying and calibrating high-precision assembly equipment (e.g., flip-chip bonders, die attach machines) to meet unique quantum 3D integration specifications.
Process Optimization: Help develop and refine placement and bonding processes (thermo-compression bonding, laser-assisted bonding, coldwelding) for non-standard substrates. Test adhesives, glues, and solders to determine which materials survive extreme thermal cycling and cryogenic vacuum conditions.
3D Assembly Execution: Execute complex integration strategies, including multi-die stacking, interposer-based 3D architectures, and orthogonal (vertical) chip placement.
Requirements
Education: BS, MS, or PhD in Mechanical Engineering, Mechatronics, Physics, Materials Science, or a related field.
Tooling Experience: 3–5 years of hands-on experience operating and adjusting high-accuracy semiconductor assembly platforms.
Precision Assembly: Demonstrated experience achieving tight placement tolerances (around 1µm) in an R&D or pilot production environment.
3D Integration Knowledge: Solid foundational understanding of 3D integration (TSVs, micro-bumps, interposers) and how structural materials behave under thermal stress, high vacuum, or cryogenic conditions.
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3D Packaging Engineer in Delft werkgever: Entangled Future
QuantWare is een uitstekende werkgever die zich richt op het ontwikkelen van baanbrekende quantumprocessoren in Delft. Met een sterke focus op samenwerking en innovatie biedt QuantWare een stimulerende werkomgeving waar medewerkers de kans krijgen om te groeien en bij te dragen aan wereldveranderende technologieën. De unieke VIO™ technologie en de mogelijkheid om te werken aan cutting-edge projecten maken het een aantrekkelijke plek voor ambitieuze ingenieurs die willen bijdragen aan de toekomst van quantumcomputing.
